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Erstellt am 28. Mai 2026

Senior Engineer New Technology Introduction and Tapeout Enablement (f/m/div)

Infineon Technologies AG
München, Bayern 80331, Germany Vollzeit
Reference: 600496357

#WeAreIn for jobs that impact everyone's life.Join the thinkers, builders, and problem-solvers behind tomorrow's technology.As a Senior Engineer New Technology Introduction and Tapeout Enablement (f/m/div) in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.Are you in?

Your Role

Key responsibilities in your new role

  • Be responsible for enabling tapeouts at New Technology introduction (NTI) and transfers
  • As Work Package Owner in NTI projects be responsible for planning and tracking of high-quality and in-time tapeout deliveries
  • Partner with cross-functional teams, including technology development, PDK development, design and manufacturing for a seamless technical support while handling at the same time shifting priorities and timelines
  • Take the lead within the NTI project for the definition and implementation of the best fit to the internal gds2mask and tapeout management system
  • Work closely with relevant stakeholders, both in house and at foundries, to implement robust and efficient tapeout processes along the qualification and production flows
  • Coordinate layout activities around provisioning of necessary content for development, optimization, qualification and transfer of in-house technology platforms
  • Manage risks and develop strategies for efficient implementation of requirements


Your Profile

Qualifications and skills to help you succeed

  • A degree in Electrical Engineering, Physics or related field
  • At least 5 years of professional experience in semiconductor industry, with a focus on new technology introduction, design, and tapeout enablement
  • Sound knowledge of semiconductor manufacturing processes and technologies in CMOS logic, HV and power derivatives
  • An understanding of device, circuit layouts, and process stackups, layout experience with the Cadence design framework and ideally experience with physical verification and signoff tools (e.g., Cadence, Siemens EDA, Synopsys, etc.)
  • Experience with utilization of general-purpose programming languages and frameworks like the Python ecosystem for data analysis, synthesis and modelling on Linux
  • Strong technical leadership and communication skills, with experience in guiding cross-functional teams and collaborating with senior management, combined with a problem-solving mindset and desire to contribute to solutions in interdisciplinary teams and ability to work in an international, multicultural and multidisciplinary environment
  • Fluent English (written and spoken); German is a plus


Contact:
Jara Bremicker, LinkedIn

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
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