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Erstellt am 12. Juni 2026

DFT Engineer, Automotive Robotics

Tenstorrent
Munich, Germany Vollzeit
Reference: 102_700906_5064078007

As part of Tenstorrent's Automotive Robotics team, you will help design and deliver the core hardware modules inside our next generation chiplet based SoCs for automotive products. You will be the bridge between silicon design, DFT, OSAT partners, and customers to ensure our multi die SiP platforms meet aggressive performance, quality, and safety targets.

This role is remote, based in Munich, Germany.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

  • Experienced with industry standard ATPG and DFx insertion CAD tools.
  • Fluent in RTL coding for DFx logic including lock-up latches, clock gates, and scan anchors.
  • Able to translate system and safety requirements into concrete constraints on package architecture, DFT insertion, and support test engineering with planning, patterns, and debug.
  • Comfortable working in a cross functional role that extends beyond DFT, including low power designs with multiple clock domains.
  • Knowledge of fault models including Stuck-at, Transition, Gate-Exhaustive, Path Delay, IDDQ, and Cell Aware.
  • Exposure to post-silicon testing and tester pattern debug are major assets.
  • Experience with Fault Campaigns a plus.

What We Need

  • Define DFx strategy for multi chiplet packages from architecture through high volume production.
  • 10+ years of experience working across multiple teams and multiple companies to coordinate test, yield, and quality efforts.
  • Feed lessons learned back into next generation SiP architectures, DFT strategy, and test content.
  • MBIST, LBIST, IST planning, implementation, and verification.
  • JTAG, Scan Compression, and ASST implementation.
  • ATPG and test coverage analysis using industry standard tools.

What You Will Learn

  • How to bring a SiP to high volume, automotive grade production.
  • How chiplets, RISC V CPUs, AI accelerators, and die to die links come together in a unified automotive platform.
  • How to trade off package architecture, DFT, and test cost to hit aggressive performance, quality, and reliability targets.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

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